Carbon Ink Printed Circuit Board Assembly High - Tg FR4 Immersion Gold + OSP
Printed Circuit Board Assembly Drescription:
The circuit boards we produced including flexible boards, rigid-flex boards, multi-layer boards, blind-hole boards, thick copper and aluminum boards. They are widely used in industrial control, medical care, automotive electronics, communications, Interne.
Printed Circuit Board Assembly Parameters:
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Min PP Thickness | 0.06mm |
Printed Circuit Board Assembly Surface Finished:
HASL,HASL Pb FreeI mmersion Gold/Tin/Silver Gold Finger Plating OSP,Immersion Gold+OSP.
Printed Circuit Board Assembly Special Capability:
Gold Finger Plating,Peelable,Carbon ink.
Printed Circuit Board Assembly Introdution:
1. The growth management of our PCB layout, fabrication, assembly and materials is driven by continued pressure to reduce time to market and keep pace with emerging technologies. Co-exhibition capabilities allow our clients to focus on their core competencies such as R&D and sales and marketing.
2. Tongzhan is fully aware of the market pressure of customers. We work according to the client's time, and because we are able to handle everything under one roof in one streamlined process, you get the benefits of working with one company and one timeline.
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Carbon Ink Pc Board Assembly High Tg FR4 OSP Printed Wiring Assembly Images
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